The design of a lumped element impedance-matching network with reduced parasitic effects obtained from numerical modeling

This paper presents an impedance-matching network design with numerical modeling of the parasitic effects. A modeling tool CEMPIE (Circuit Extraction approach based on a Mixed Potential Integral Equation formulation) is used to model the board-level parasitics of surface mount technology (SMT) resistors for impedance-matching networks. A 3-layer design of impedance-matching network with 0402 SMT resistors is implemented according to the modeling results. And its performance is demonstrated.