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Research on nano-thermocompression bonding process using nanoporous copper as bonding layer
Research on nano-thermocompression bonding process using nanoporous copper as bonding layer
2014
Xiaogang Liu
Sheng Liu
likecheng
Mingxiang Chen
Keywords:
Thermocompression bonding
Copper
Nanotechnology
Nanoporous
Nano-
Materials science
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