Transponder location and processes for their preparation

The invention relates to a transponder layer (30), in particular for producing a formed for example as a smart card laminate structure with an antenna substrate (31), the antenna on an antenna side (38) formed with one of a wire conductor (32) (33) and a chip ( 41 is) provided, and which has on the antenna side terminal conductors for the connection of the chip with the wire conductor of the antenna, so that in addition to terminal ends of the chip (34, 35) of the wire conductor is arranged, and both of the terminal ends of the wire conductor and on a the antenna substrate facing contact side of a semiconductor body of the chip arranged chip terminals (39, 40) are contacted with the connection conductors. Furthermore, the invention relates to a laminate for an inlay formed from multiple laminate layers laminate structure with such a transponder location and an IC card having such a laminate inlay and a method for producing such a transponder location.