UHF Film Integrated Circuits.

Abstract : The purpose of this project is to investigate lumped-element versus microstrip circuitry for use (1) at microwave frequencies (up to X-band), (2) with high-power active devices, and (3) as transforming networks between radically different impedances. (a) Materials and Technology - Thin-film lumped-element circuits have been constructed using a technique which allows densification of the dielectric without any degradation of circuit metal. The circuit losses have been markedly improved because of the improved dielectric. (b) Measurement Technique - The Q of an inductor and a diode up to X-band has been measured using transmission resonance techniques. The inductor Q was over 200 at 6 GHz. The diode Q was measured using a coaxial line resonant system. The criteria for the measurement of Q's of lumped elements by resonating with distributed lines are discussed. (c) lumped-Element Hybrids - Low-pass filters and quadrature hybrids have been fabricated in thin-film lumped-element form. The performance of these circuits in the S-band region is discussed. (d) Lumped-Element Amplifiers - New lumped-element circuits have been designed and their layout and design are discussed. (e) Distributed Circuits - The characteristics of coupled microstrip lines have been studied, and definitive measurements on odd- and even-mode impedances and velocities have been made. Nichrome resistors have been studied and show improved stability compared with chrome resistors. A microstrip mixer-detector tester is described. (Author)