The channel member and the heat exchanger and a semiconductor device using the same

Flow path flow path member and a heat exchanger and a semiconductor device using the same suppressed breakage is provided. A flow path member of the present invention (1) constitutes the lid portion (2) and the partition wall portion (3b) and side wall (3) and the bottom plate (4) and out channel through the fluid inside the (5) , on at least one of the lid portion (2) and the bottom plate portion (4), since at least one part of the partition wall portion and side wall portion is joined directly penetrates, repeated channel member (1) even thermal stress occurs, damage to each of the joint portions (8) of the lid portion (2) barrier rib (3b) side wall portion (3) the bottom plate portion (4) occurs which constitutes a flow path was suppressed, enhanced sealability of the flow path (5). Further, possible to suppress the flow path even when the flow of high pressure fluid (5) the channel (5) is destroyed, the heat exchanger and the semiconductor device thermal stress using the channel member (1) by can be suppressed destruction of the flow path, it is possible to improve the heat exchange efficiency, it is possible to improve the reliability.