The Hybrid DC-DC Microcircuits Case Temperature Control in Burn-in Process

For the high-efficiency,the low-weight,the high-reliability,the better-sealing,The hybrid DC-DC microcircuits have been used largely in the electronics machine of the high-reliability and the military electronics systems.This article introduces briefly the thermal model of single power integrated circuit and gives the calculate method of the temperature rise according to the output power,the efficiency and the packaging thermal-risistance.How to set the ambient temperature according to the highest case temperature in the burn-in process.Based on the analysis of the dissipate factor of the different materials,results showed that the aluminium-alloy is the best material to make heat-sink.The case temperature can be effected by the assembly position of the heat-sink and the air flow velocity,gives the case temperature measure datas of the different hybrid DC-DC microcircuit.This article also gives the customer advices for the assembly and the use.