Chip size semiconductor package and fabrication method thereof

PURPOSE: A chip size semiconductor package and its manufacturing method are provided to enhance the reliability of a solder joint when mounting a semiconductor package on a printed circuit board, therefore raise the effect of discharging heat generated from the chip and finally provide with a compact CSP. CONSTITUTION: The chip size semiconductor package includes a semiconductor chip(31) having a number of bonding pads, a number of first leads(33) placed to correspond with the bonding pads on both sides of the semiconductor chip(31), a number of conductive connection elements(37) which electrically connect the bonding pads and the first leads(33), a number of second leads(35) formed on the first leads(33), each second leads(35) having a first part(35a) formed on the external end of the first leads(33) and a second part(36a) extended outward from the first part(35a) and cut upward, a number of connection parts(37) formed on the semiconductor chip(31) to expose the second part(36b) of the second lead(35), and a molding part(39) sealing the first part(35a) of the first and second leads(33,35).