Materials and mechanics issues of solder alloy applications

The key conclusion out of the Solder Mechanics Workshop is that, overall, the technical and scientific community does not know as much quantitatively about solder behavior as we had hoped. The good news, however, is that the microelectronics user community, which is largely served by solder activities, has come to terms with the current environment through active participation in the workshop. The air has been cleared. As a technical community, we have a better idea of what our priorities for continued research are. A much more detailed overview of the workshop will be available shortly in monograph form. Individual chapters will be written by authors present at the workshop and will emphasize background material (e.g., literature critiques) and detail the technical consensus on critical issues central to the workshop. The book will be available through TMS and will be the first volume in a new series of technical monographs sponsored by the society's Electronic, Magnetic and Photonic Materials Division.