GaAs Wafer Breakage Reduction

We present results of many years of work for breakage reduction of GaAs wafers at Skyworks. Incoming wafers are seen to be strong. Micro-scratches and micro-cracks added during processing reduce the strength of processed wafers. However, wafer strength reduction is not linear and breakage rate does not increase simply by adding fabrication steps. Instead, wafer breakage and strength reduction is a function of process and tool type. Wafers may break at a tool or weakened wafers may break later. Once attention is given to the main culprits and issues resolved, breakage goes down. A few specific examples will be described.