Extra Bonding Layer Compensates Universal Adhesive's Thin Film Thickness.

Purpose Universal adhesives (UAs) are applied in 2-step etch-and-rinse (2-ER Kerr), which was also employed in 2-SE mode. As a cross reference, the SE primer of Clearfil SE Bond 2 (Kuraray Noritake) was combined with Opti-FL_ar (C-SE2/Opti-FL) and again applied in 2-SE and 3-ER C-UBq presented an intermediate and G-PrB the lowest µTBS. No significant differences were found between different bonding modes. C-SE2/Opti-FL outperformed Opti-FL in 3-E&R and 2-SE_1 month/25k. Conclusion The overall benefit of EBL on the 1-month and TC-aged bonding efficacy differed for the different UAs tested.