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Enhanced thermal and microstructure properties of Sn-1.0Ag-0.7Cu based lead-free solder with Titanium Oxide addition
Enhanced thermal and microstructure properties of Sn-1.0Ag-0.7Cu based lead-free solder with Titanium Oxide addition
2019
Rita Mohd Said
Norainiza Saud
Norhayanti Mohd Nasir
Mohd Arif Anuar Mohd Salleh
Mohd Nazree Derman
Mohd Izrul Izwan Ramli
Keywords:
Soldering
Titanium oxide
Composite material
Microstructure
Materials science
Thermal
Correction
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