Semiconductor light-mitting device
2012
The following are provided: a resin package that has a recess; a lead frame (11) exposed at the bottom of said recess; a semiconductor light-emitting element (14) mounted on said lead frame (11) inside the recess; a resin layer (17) formed so as to contact the lead frame (11) inside the recess and cover the bottom of the recess; and a quantum-dot phosphor layer (19) formed on top of the resin layer (17) and the semiconductor light-emitting element (14). The resin layer (17) contains ceramic microparticles (15), and the quantum-dot phosphor layer (19) contains the following: semiconductor microparticles with an excited fluorescence spectrum that varies with particle size; and a resin in which said semiconductor microparticles are held so as to form a dispersion.
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