Adhesive film, adhesive sheet, a method of manufacturing a semiconductor device and a semiconductor device

PROBLEM TO BE SOLVED: To provide: an adhesive film and an adhesive sheet which can be stuck on a member such as a semiconductor wafer and can be easily peeled off from a member such as a dicing sheet; and a semiconductor device and a method for manufacturing the semiconductor device using the same. SOLUTION: The adhesive film 1 comprises a high tuck face A and a low tuck face B. When the tuck strength of the high tuck face A at 40°C is FA and the tuck strength of the low tuck face B at 40°C is FB, a relation of FA-FB≥10 gf and FA≥10 gf is satisfied. The high tuck face A contains a first adhesive resin composition and the low tuck face B contains a second adhesive resin composition different from the first adhesive resin composition. COPYRIGHT: (C)2010,JPO&INPIT