The DUF Project: A UHV Factory for Multi-Interconnection of a Molecule Logic Gates on Insulating Substrate
2012
The scientific and technical challenges involved in the building of the planar electrical connection of an atomic scale circuit to N electrodes (N > 2) on insulating substrates are presented. In the Nanoscience group of Toulouse, the UHV factory has been developed since ten years in order to realize under UHV the five levels of interconnections on insulating substrate, to characterize by NC-AFM the different steps and to measure the electrical properties of the realized device.
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