Cooling device for an electronic equipment

Cooling apparatus for electronic device according to the present invention, the first surface (2A) and a second surface (2B) and a printed wiring board having an opening (2C) penetrating from the first surface to the second surface (2), the opening thermal filler (4) made of a material having good filled thermal conductivity, a filler is mounted on the first surface of the printed wiring board so as to thermally contact the heat generating component (6), the filler It includes heat diffusion plate disposed on the second surface of the printed wiring board in contact with (20), and a heat pipe (22) provided in thermal contact with the heat diffusion plate. According to this configuration, it is possible to provide a cooling device capable of cooling the effective heat generating component suitable for miniaturization of the apparatus.