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Multiple Level Plated Gold Interconnect for HEMT Compaction
Multiple Level Plated Gold Interconnect for HEMT Compaction
2006
Jansen Uyeda
Jennifer Wang
M. Barsky
Ron Grundbacher
Ke Luo
Raffi Elmadjian
L. Dang
Chi Cheung
Danny Li
D. Farkas
Keywords:
Compaction
Electronic engineering
High-electron-mobility transistor
Materials science
Metallurgy
Interconnection
Correction
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