Electrical interconnection structures and methods for fabricating the same

The present invention relates to an electrical connection structure and a method for fabricating the same and comprises; a substrate having a bonding pad area in which a bonding pad is arranged, and a fuse area in which a fuse is arranged; an insulating film which is arranged on the substrate and has a bonding pad opening part for opening the bonding pad, and a fuse opening part for opening the fuse area; a connection terminal which is arranged with in the bonding pad area and is electrically connected to the bonding pad; and a protection film which is arranged on the insulating film and has a first protection film limited to the bonding bad area, and a second protection area for filling the fuse opening part.