Process design based on temperature field control for reducing the thermal residual stress in glass/glass laser bonding

Abstract This paper presents a process design method based on temperature field control for reducing the thermal residual stress in glass/glass laser bonding. The effect of the starting point, the shutting down rate of the laser and the substrate temperature on the temperature field and sequential residual stress of the substrates was investigated by ANSYS and experimental validation. The results show that the residual stress could be reduced by starting the bonding avoiding the corner of the path, turning the laser off gradually and heating the glass substrates, which influence the temperature field at the scale of point, line and surface, respectively. Thereby, the formation probability of cracks is inhibited, and the bonding quality is improved.