A device for in particular thermally connecting micro-electro-mechanical components

The invention relates to a device for the particular thermal bonding micro-electro-mechanical components (2, 3) in a process chamber (8), with a lower platen (11) for receiving at least a first component (2) of the components to be joined (2, 3 ) and with a pressing device (15) for pressurizing at least one second component (3) of the components to be joined (2, 3) relative to the at least one first component (2). The pressing device (15) is formed with a provided for contacting with the at least a second component (3), stretchable membrane (19). This membrane (19) facing away from the components to be joined (2, 3) side by fluid pressure, particularly gas pressure to be acted upon.