Wideband electrical modeling of large three-dimensional interconnects using accelerated generation of partial impedances with cylindrical conduction mode basis functions

For wideband modeling of large and complicated three-dimensional interconnects, this paper proposes an efficiency improvement in solving electric field integral equation with cylindrical conduction mode basis functions. Based on the multifunction method, the improved method reduces computational cost by using smaller number of higher-order basis functions for computing mutual inductances between far-separated conductors. From the modeling examples of through-hole vias and bonding wires in stacked IC’s, the proposed method is verified for application to real three-dimensional interconnects.