Photonic integration: from wafer level to the module

Photonics integration continues to be a main driver for innovation in multiple aspects, including wafer-scale integration, new materials, sub-micron alignment of components and protection from harsh environment. We show cost-effective fabrication technologies of micro-optical components by UV wafer-scale replication into chemically stable polymers. Furthermore, for simplified fiber coupling and packaging, a novel 90° optical interconnect is presented, integrated with self-alignment structures. Replicated, space compliant microlenses on packaged CMOS imagers show improved light sensitivity by a factor 1.8. A laser based, low stress bonding process is explored to generate wafer-scale hermetic enclosures for harsh environment applications ranging from space to implants.