High polymer bonding material

The invention discloses a high polymer bonding material which comprises the following components in parts by weight: 42 parts of epoxy resin, 22-58 parts of a packing, 11 parts of a methylacryloyloxyethyl silane coupling agent, 28 parts of an alicyclic amine epoxy curing agent, 2.2 parts of triphenyl phosphite, 2.8 parts of a brominated epoxy resin flame retardant and 2 parts of castor oil polyglycidyl ether. The heat-conducting packing is adopted, so that the heat-conducting performance of the whole system is improved; in the preparation process, the packing is subjected to mixing pretreatment by selecting a coupling agent in a targeted mode, so that the surface of the packing is coated by the coupling agent, and the compatibility of the packing and resin is further enhanced; the curing reaction is full by virtue of modes of adding the aids and adding the epoxy resin agents in batches, and the adhesive performance of the product is improved; and moreover, the high polymer bonding material disclosed by the invention has excellent bonding performance, has the peel strength of more than 200kg/mm and is high in heat-conducting coefficient, and the preparation method is easy to operate and high in cost performance.