Phase Evolution When Sn Reacts with Cu-Ti Compounds at 823 K

In this study, Cu/Ti diffusion couples annealed at 1023 K for 1000 h were annealed with molten Sn at 823 K for 15–480 min. With the addition of Ti, the consumption speed of Cu is greatly enhanced. At 823 K, a Cu plate with a thickness of about 3 mm dissolved from a solute into Sn in less than 15 min. Cu-Ti binary compounds still have different consumption speeds in molten Sn. The grown-out Cu-Ti binary compounds show great anisotropism in this work, and there are quick diffusion paths vertical to the Cu-Ti interface that form in them. With the progressing of annealing, different tri-junctions, which mean correlative three-phase regions in the isothermal section, appear in the samples sequentially at 823 K. After annealing at 823 K for varying times from 15 min to 480 min, the morphologies of diffusion zones are illustrated with diffusion paths.