High-Temperature Reliability of Copper Wire-Bonded Packages Encapsulated with Mold Compounds Containing Sulfur Compounds

Cu wire-bonded (CuWB) packaging is more susceptible to corrosion than traditional inert gold wires. CuWB reliability greatly depends on the compatibility of Cu wire with the surrounding encapsulating mold compound as this matrix can provide a corrosive environment leading to reliability issues. Many mold compounds contain specific components, which are sulfur-based compounds. Since the reliability testing of an encapsulated packaged device involves thermal treatments, such as the high-temperature storage life (HTSL) test, there is a concern that corrosive sulfur compounds can be produced at high temperatures (e.g., 150°C and 175°C), endangering CuWB reliability. This article describes detection methods of sulfur compounds produced from mold compounds, if any, at high temperatures such as 175°C and CuWB die package reliability with mold compounds containing sulfur compounds. The dynamic headspace concentration-gas chromatography-mass spectroscopy analysis technique was used to test liberation of gaseous an...