The influence of thermal processing on the structure and composition of the surface of copper bedding

The surface of a copper plate for compounding is studied before and after its oxidation. The heat treatment in the air in the temperature range of 100–200°C for 10–40 min enables the formation of a thin solid layer of copper oxide, CuO, eliminates the porosity of the surface of the copper plate, modifies its micro-structure, and substantially increases the surface maturity, and thus increases the adhesion in the Cu-polymer system. This phenomenon was proved by Auger spectroscopy (ASS), scanning electron microscopy (SEM) and atomic forced microscopy (AFM).