Preliminary study of the effects of carbon nanotubes on Cpu cooling

Managing heat produced by computer processors is an important issue today, especially when the size of processors is decreasing rapidly while the number of transistors in the processor is increasing rapidly. This poster describes a preliminary study of the process of adding carbon nanotubes (CNTs) to a standard silicon paste covering a CPU. Measurements were made in two rounds of tests to compare the rate of cool-down with and without CNTs present. The silicon paste acts as an interface between the CPU and the heat sink, increasing the heat transfer rate away from the CPU. To the silicon paste was added 0.05% by weight of CNTs. These were not aligned. A series of K-type thermocouples was used to measure the temperature as a function of time in the vicinity of the CPU, following its shut-off. An Omega data acquisition system was attached to the thermocouples. The CPU temperature was not measured directly because attachment of a thermocouple would have prevented its automatic shut-off A thermocouple in the paste containing the CNTs actually reached a higher temperature than the standard paste, an effect easily explained. But the rate of cooling with the CNTs was about 4.55% better.