Micromechanical sensor arrangement and corresponding method of production

The present invention provides a micromechanical sensor arrangement, and a corresponding manufacturing method. The micromechanical sensor arrangement comprises a substrate (1) having a cavity (K) which is spanned by a diaphragm region (M). The diaphragm portion (M) has a heatable plate-shaped central region (T) and one or more web-like regions (S1, S2; S1 ', S2'), via which the heated plate-shaped central region (T) with the surrounding substrate (1) connected is. The heated dish-shaped central portion (T) is through at least one of the substrate (1) connected to the support (ST; ST '; ST' '; ST1, ST2) in a direction perpendicular to the membrane region (M) extending towards supportable.