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Vacuum underfill technology for advanced packaging
Vacuum underfill technology for advanced packaging
2011
Akihiro Horibe
Marie-Claude Paquet
Michael A. Gaynes
Claudius Feger
Katsuyuki Sakuma
John U. Knickerbocker
Yasumitsu Orii
Masumi Hoshiyama
Makoto Hasegawa
Terukazu Sato
Haruyuki Yoshii
Osamu Suzuki
Kiyoshi Kotaka
Taiji Nagasaka
Kenji Terada
Koichi Ishikawa
Yuki Hirayama
Keywords:
Chip
Process optimization
Flip chip
Electronic engineering
Materials science
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