Optical Waveguides in the Computer Environment a Packaging Perspective

SummaryThe integration of optical and electrical functions in theworld of high-performance computer packaging is a major chal-lenge. Recent developments in OE chip integration, self-align-ment of optical components, and planar processed optical wave-guide technologies offer opportunities for meeting this chal- lenge. References:[1] "Thermal Conduction Module: A High-Performance MultilayerCeramic Package", J. Blodgett and D.R. Barbour, IBM J. Res. andDevelop. 26, (1982) 30[2] Microelectronic Packaging Handbook, R.R. Turnrnala and E.J.Rymaszewski editors, Van Nostrand Reinhold, NY 1989[31 "OEIC Technology and its Application to Subscriber Loops", T . Horimatsu and M . Sasaki , J . Lightwave Technol . , vol . LT-7, pg. 1612, (1989) [41 "Optoelectronic Circuits for High Speed Computer Networks", J.D. Crow, Optical Fiber Communications Conference, Tech. Digest, Houston, 1989 [51 "Packaging for a 1 Gb/s OEIC Fiber Optic Data Link", K.P.Jackson, E. Flint, M. Cina, A. Moll, J.F. Ewen, D. Flagello, R.Rand, and S. Purushothaman, Proceedings of Electronic ComponentConference, Houston, 1989