Adhesive film for semiconductor

PURPOSE: An adhesive film for semiconductor is provided to have double-layered structure which have different physical properties from each other, thereby having excellent separation properties in dicing process and excellent wire penetration performance in packaging process, and capable of remarkably reducing foamable void. CONSTITUTION: An adhesive film for semiconductor comprises a first adhesive layer(102) in which silica(112) with first average diameter is contained, a second adhesive layer(104) in which silica(114) with second average diameter larger than the first average diameter, laminated on the first adhesive layer. The modulus ratio of the first adhesive layer to the second adhesive layer at 150°C is 1-5. The silica is spherical silica. The first average diameter is 0.01-1.0 micron. The second average diameter is 0.1-5.0 micron. The silica content of the first adhesive layer is 20-40 weight% based on the whole first adhesive layer.