Thermosetting resin composition and molded body thereof

The present invention addresses the problem of providing a highly reliable thermosetting resin composition which is suitable for use in a sealing material for a semiconductor device and in which warpage and cracks do not occur even when used in a power device, in particular. The problem is solved by a thermosetting resin composition that includes a thermosetting resin and a curing catalyst, wherein the cured product of the thermosetting resin composition has a storage modulus at 25 °C of 1.0×10 6 -1.0×10 10 Pa, inclusive, and has an average linear expansion coefficient at 70-210 °C of 100 ppm/K or less.