Graphene modified high-temperature resistant adhesive for bonding carbon/carbon composites: microstructure characterization and properties study

Abstract A novel graphene modified high-temperature resistant adhesive for bonding carbon/carbon composites was developed. The effects of graphene content on the mechanical properties, thermal conductivities and braking properties of the carbon/carbon joints were studied. When the graphene content in the adhesive was 1.5 wt.%, the specimens possessed the bonding strength of 13.2 MPa and the thermal conductivity of 23.89 W/(m•k), which were 63.09% and 145.03% higher than those of 0.0 wt.%, respectively, and 24.38% and 64.53% higher than those of 5.0 wt.%, respectively. The excellent properties were attributed to the uniform dispersion of graphene in the adhesive matrix, which could effectively reduce the stress concentration and provide a fast heat conductivity network chain. The adhesive properties also had an obvious influence on the braking performance. Finite element analysis considered that the main reason for the difference in braking performance was that the temperature and field distribution on the friction surface were affected by the thermal conductivity of the adhesive.