Multilayered chip board for mounting the electronic component and the electronic component

Provides a multilayer chip electronic component, comprising: a ceramic body, the ceramic body comprising internal electrodes and dielectric layers; outer electrode, the outer electrode covers the ceramic body in the longitudinal direction both end surfaces; a first layer, said second a plating layer forming the outer electrode and is formed on the outer surface of the ceramic body; nonconductive layer, the non-conductive layer is formed on the outer surface of the first plating layer; and a second layer, said second plating layer is formed on the first plating layer in addition to the non- region other than the conductive layer.