Old Web
English
Sign In
Acemap
>
Paper
>
Investigation on Process Parameters on the Adhesion of Electroless Ni-P Film on Silane Compound Modified Si Wafer
Investigation on Process Parameters on the Adhesion of Electroless Ni-P Film on Silane Compound Modified Si Wafer
2016
Chin-Wei Hsu
Wei-Yan Wang
Tzu-Chien Wei
Keywords:
Wafer
Adhesion
Silane
Metallurgy
Composite material
Materials science
Nanotechnology
Chemical engineering
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]