A method of manufacturing an integrated coil in a substrate, method of manufacturing a multilayer printed circuit board and electronic device

A method of manufacturing a in a substrate (100) integrated coil (140) comprising the steps of: - introduction of a core material (116) in a cavity (106) of the substrate (100) - introduction of the first turn portions (136) of the coil (140) in the core material, which extend through the core material therethrough, - application of the second turn portions (138) of the coil (140), the second turn portions (138) contact the first turn portions (136), to realize the windings of the coil (140).