Packaging method and packaging structure for embedded light emitting diode

The invention belongs to the field of semiconductor lighting. The invention discloses a packaging method and a packaging structure for an embedded high-power light emitting diode (LED) module. The module can be used for assembling various LED lighting lamps. The packaging method for the embedded high-power LED module comprises the following steps of: (1) stamping array-type pits on a thin metal sheet; (2) manufacturing a silver film serving as a light reflecting layer by an electroplating method; (3) manufacturing an electrode isolation layer, a positive electrode pattern and a negative electrode pattern on the metal sheet by adopting screen printing, and connecting each positive electrode window and negative electrode window in series and parallel; and (4) fixing LED chips in the pits, painting fluorescent powder on the surfaces of the chips, and molding by leading, gluing, and heating for curing. The packaging structure has a simple manufacturing process, low cost, a good module radiating effect, and suitability for large-scale production.