Reduced reverse gate leakage current for GaN HEMTs with 3 nm Al/40 nm SiN passivation layer

An obvious increase in the gate leakage current has been commonly observed in GaN HEMTs, after Plasma-enhanced chemical vapor deposition (PECVD) SiN passivation has been observed to obviously increase. This paper presents an Al/SiN stack layer passivation structure. The high gate leakage current in GaN HEMTs caused by the PECVD SiN passivation is distinctly reduced by 2 to 3 orders of magnitude by introducing a thin Al layer. It is mainly attributed to the Al layer blocking and minimizing the damage for the (Al)GaN surface in the build-up of the luminance process of PECVD SiN and then reducing the surface trap density. TEM mapping and SRIM software simulation reveal that neither damage nor inter-diffusion is demonstrated at the Al/AlGaN interface, where a continuous crystalline region is observed. The moderate current collapse suppression and 32.8% improvement in VBR are achieved in GaN HEMTs with Al/SiN passivation.