Epoxy/Cyanate Ester Copolymer Material for Molding Compounds in High-Temperature Operations

As the number of electronic components in automobiles increases, the electronic industry has seen an increasing demand for organic packaging materials that meet property requirements for long operations in harsh environments. One of the most challenging requirements for molding compounds for automotive electronics is high thermal stability. The plastic encapsulation material should survive continuous operations beyond 150 °C. Epoxy-based molding compounds (EMCs) are widely used encapsulant in electronic packages for their high performance and low cost. However, EMCs generally fail high-temperature operation tests and new encapsulant materials should be developed. In this report, epoxy/cyanate ester copolymers are prepared and their curing, thermomechanical, and thermal aging properties are evaluated.