Substrate embedding electronic component and manufacturing mehtod thereof

The present invention includes a first insulating layer comprising as the cavity on the substrate the electronic component is embedded; Is inserted into the cavity, the electronic component having an external electrode, at least one or more; A first metal pattern that is formed on the lower surface of the first insulating layer including the guide holes, at least one or more of the electronic components are mounted, and, exposing the outer electrode portion; A second insulating layer which is formed on the lower surface of the first insulating layer covering the first metal pattern; A first circuit pattern formed on the lower surface of the second insulating layer; And between the outer electrode and the first circuit may include a first via electrically connecting the pattern, even if the external electrode size of the electronic component becomes smaller than the conventional external electrode and the via is exposed through the guide holes the electrical connections can be improved.