Low-cost technique for reducing the simultaneous switching noise in sub-board packaging configurations
1997
A low-cost technique for reducing simultaneous switching noise in a sub-board packaging configuration has been developed. By using a thin insulator film made of conventional FR4 substrate material, the noise is reduced about 50% when 32 switching gates are simultaneously driven at 622.08 Mb/s in a sub-board with an area of 11/spl times/10 cm.
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