A method for processing a substrate

A method for processing a substrate, comprising: Forming a trench in the substrate; Depositing stamp material at least in the trench; Embossing the embossing material in the trench using a stamping device; Removing the stamp device of the trench; Depositing filler material at least in the trench after removing the stamp device; and Removing the embossing material from the trench, after the deposition of the filling material, wherein the filler material remains in the trench during the removal of the embossing material.