Solvent composition for manufacturing electric device

Provided is a solvent composition capable of inhibiting a reduction in electrical characteristics, defects in wiring and coating film formation, and the occurrence of delamination, the solvent composition serving as a raw material of a paste composition for forming a coating film or wiring of an electronic device by coating on a coating surface member by printing. This solvent composition for manufacturing an electronic device is used for manufacturing an electronic device by printing, wherein the solvent composition comprises a solvent and a compound (excluding monohydroxy steric acid) expressed by the following formula (1) R 1 -CH 2 -R 2 (1) (where R 1 represents a monohydroxyalkyl group, and R 2 represents a carboxyl group (C(=O)OH) or an amide group (C(=O)NH 2 ).