A novel approach to thermal tests for flash memories reliability improvement based on DoE method

The different steps of an assembly process of NAND flash memories could cause thermal or mechanical stresses that induce faults in their programming. We analyzed the probably faults and to solve the problems found we indicated the interesting parameters and implemented a DoE (design of experiments) as an instrument to plan the laboratory tests. The flash memories under test are Pb-free and our trials shown an improvement when a new conductive silver glue is used in the assembly process.