Optical pre-alighment apparatus for submicron photoetching device

The utility model discloses an optical pre-alignment apparatus for submicron photoetching machines. The apparatus comprises a lighting system of silicon wafer alignment marks, an imaging light path, a four-quadrant detector for receiving marks, an amplifying circuit connected with the four-quadrant detector, an A/D converter, a computer, and a work piece table control system of a photoetching machine for finishing pre-alignment. Two ways of alignment marks are imaged onto a CCD detector via an imaging prism; a display displays raster mark images of imaging alignment in separated view fields. The apparatus has no need of being added with an especially-arranged high-precision optical pre-alignment servo working table, also no need of a high-precision gas shaft manipulator, and only has need of a general-precision transmission manipulator.