Electric field enhanced capillary micro injection moulding method

The invention discloses an electric field enhanced capillary micro injection moulding method which comprises the following steps of: firstly, etching a required pattern structure on silicon to obtain a female mould; then, pouring silicon rubber on the female mould, and pressing a flexible plastic sheet with a transparent conductive layer onto the silicon rubber; curing the silicon rubber, and demoulding to obtain a flexible transparent conductive mould; placing the flexible conductive mould on a substrate, wherein the flexible conductive mould and the substrate form a micro/nano flow channel with two transparent ends; adding the droplets of light-cured resin dropwise to one end of the flow channel, and applying voltage between a conductive layer of the flexible conductive mould and the substrate, wherein the light-cured resin flows to the other end of the flow channel; and finally, after the light-cured resin flows to the other end of the flow channel, curing the light-cured resin, and demoulding to obtain a micro/nano pattern without film reserved. The method disclosed by the invention has the advantages of increasing the length of capillary flow, shortening the flowing time and improving the flowing efficiency.