Integrated heat sink-heat pipe thermal cooling device

This paper discusses the design and manufacturability of an optimal thermal cooling solution for microelectronic chips and packages comprised of the integration of folded fin heat sink and heat pipe technologies. This cooling solution is shown to provide a heat-sink-to-ambient thermal resistance of 0.2/spl deg/C/W. Current extruded heat sink technology being used for the Pentium II generation of microprocessors provides a heat-sink-to-ambient thermal resistance of 0.7-0.8/spl deg/C/W. Thus the integration of the folded fins to a vapor chamber base provides nearly a 4/spl times/ improvement on previous HVM enabled heat sinks. The optimization of this thermal cooling solution to yield a robust, cost effective design by leveraging high volume manufacturing (HVM) technologies is described in this paper.