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Pattern Damage and Slurry Behavior Analysis of CMP Process by Mechanical and Fluid Simulations
Pattern Damage and Slurry Behavior Analysis of CMP Process by Mechanical and Fluid Simulations
2015
Yi-Sheng Cheng
Wen-Cheng Yang
Shing-Ann Luo
YuKai Huang
Yung Tai Hung
Tuung Luoh
Lin-Wuu Yang
Tahone Yang
Kuang-Chao Chen
Keywords:
Slurry
Composite material
Materials science
Correction
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