Manufacturing process of a capacitor embedded in PCB

A method for manufacturing a capacitor embedded in a printed circuit board is provided to prevent a leakage current from being occurred by sequentially forming a dielectric layer and an upper electrode on a copper clad lamination substrate of which surface detects are removed. A method for manufacturing a capacitor embedded in a printed circuit board includes the steps of: preparing a copper clad lamination substrate(110) composed of a reinforcing material and a copper layer(112) stacked on both sides of the reinforcing material; cleaning and drying the copper clad lamination substrate(110) sequentially; smoothing a surface of the copper layer(112) of the copper clad lamination substrate(110); forming a dielectric layer(120) on the smoothed copper layer surface; and forming an upper electrode(130) on the dielectric layer(120). The smoothing step of the copper layer surface is performed through a mechanical polishing or an electro polishing process.