Strain-induced semi-solid forming process and die for magnalium mobile phone shells

Disclosed is a strain-induced semi-solid forming process and die for magnalium mobile phone shells. The process includes cutting a magnalium plate with certain compressive deformation into the suitable size, performing semi-solid heat preservation on the cut magnalium plate, and then putting the obtained magnalium plate with semi-solid characteristics into the preheated die for extrusion forming. The die comprises a mobile phone shell bottom cavity die device, the upper side of the mobile phone shell bottom cavity die device is connected with a mobile phone shell top terrace die device, die guide rods are assembled on the mobile phone shell top terrace die device, a left mobile phone shell core-pulling slider is connected to the left of the mobile phone shell bottom cavity die device, a right mobile phone shell core-pulling slider is connected to the right of the mobile phone shell bottom cavity die device, and mobile phone shell ejection mechanism is connected to the lower side of the same. The magnalium mobile phone shells with superior performance can be produced, and the process and the die have the advantages of simple process, high forming speed, low cost and the like.