Old Web
English
Sign In
Acemap
>
Paper
>
Conductivity assessment of conductive polymer bonding for flip chip applications
Conductivity assessment of conductive polymer bonding for flip chip applications
2000
Ming Sun
Mike Loo
Sanjay Dandia
Keywords:
Thermal copper pillar bump
Thermal expansion
Optoelectronics
Composite material
Electrical resistivity and conductivity
Conductivity
Flip chip
Contact resistance
Conductive polymer
Materials science
Correction
Cite
Save
Machine Reading By IdeaReader
10
References
0
Citations
NaN
KQI
[]